By Charles Chiang, Jamil Kawa
This publication walks the reader via all of the facets of manufacturability and yield in a nano-CMOS strategy. It covers all CAD/CAE facets of a SOC layout circulation and addresses a brand new subject (DFM/DFY) serious at ninety nm and past. This e-book is a needs to learn e-book the intense training IC clothier and a very good primer for any graduate scholar cause on having a profession in IC layout or in EDA device improvement.
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Additional info for Design for Manufacturability and Yield for Nano-Scale CMOS (Integrated Circuits and Systems)
The typical time needed for a product from concept to first silicon is product dependent but is estimated on an average to be two years with a total cost anywhere from $25 Million to $40 Million. A typical re-spin is 6 months. Now, the cost of a re-spin is interesting to figure out. From a materials and engineering time perspective it is no more than perhaps $2 millions. 6. 10. Revenue as a Function of Design Cycle half the total revenue of the product. In fact being six months late to market for some products (Christmas season sales dependent) might cost the whole product cycle.
6 is the object for which the pseudo open critical area is formulated. 6. Open Critical Area on Wire i the actual open critical area on wire i begins to overlap with those on wires j and k. In order to avoid counting the overlap regions more than once when calculating the total open critical area, the concept of pseudo open critical areas is introduced. For small defect sizes, when the actual open critical area on wire i has no overlap with the ones on any other objects, the pseudo open critical area is defined to be the same as the actual open critical area.
Two re-spins and the product is most likely obsolete. 3 DFM Categories and Classifications There are essentially two major categories of DFM/DFY namely first time loss and time related failures. In this book we focus on first time loss only although many of the time related failures can and should be addressed at the design stage, but are simply more appropriate for a circuits design book or a book on IC reliability and failure analysis than for a book dealing with DFM/DFY. 16). 1 First Time Failures First time failures refers to the situation where a chip comes out with a severity of functionality failure ranging from silicon that is fully operational but does not meet the product specification in timing, power, IEEE standards, or a combination of those issues, to silicon that comes out with fatal failures that is reflected in the chip simply showing no life at all.