By Fred Roozeboom (auth.), Fred Roozeboom (eds.)
Rapid thermal and built-in processing is an rising single-wafer expertise in ULSI semiconductor production, electric engineering, utilized physics and fabrics technology. right here, the physics and engineering of this know-how are mentioned on the graduate point. 3 interrelated components are coated. First, the thermophysics of photon-induced annealing of semiconductor and similar fabrics, together with primary pyrometry and emissivity concerns, the modelling of reactor designs and techniques, and their relation to temperature uniformity. moment, strategy integration, treating the advances in uncomplicated gear layout, scale-up, built-in cluster-tool apparatus, together with wafer cleansing and built-in processing. 3rd, the deposition and processing of skinny epitaxial, dielectric and steel movies, overlaying selective deposition and epitaxy, built-in processing of layer stacks, and new components of strength software, corresponding to the processing of III-V semiconductor constructions and skinny- movie head processing for high-density magnetic info storage.
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Additional resources for Advances in Rapid Thermal and Integrated Processing
B. E. Glaser, Appl. Optics 2,265 (1963). 48. E. Sheets, Nucl. Instrum. Meth. Phys. Res. 86,219 (1985). 49. E. Sheets, Mat. Res. Soc. Symp. Proc. 52, 191 (1986). 50. E. Sheets, US Patents 4 649 261 (10 March 1987) and 4 698 486 (6 Oct. 1987). 51. E. K. Ma, J. Opt. Soc. Am. 64, 339 (1974). 52. A. Gouffe, Revue d'optique 24, 1 (1945). 53. C. Lee and G. Chizinsky, Solid St. Technol. 32 (1), 43 (1989). 54. C. S. Patent 4857689 (15 Aug. 1989). 55. M. Camm and B. Lojek, Proc. 2nd Int. RTP Conference, RTP'94, Aug.
Lee, D. Anderson and C. Davis, Microelectr. Eng. 25, 93 (1994); see also Chapter 6 of this book. -L. Regolini, J. Margail, C. Morin, P. Gouy-Pailler, Mat. Res. Soc. Symp. Proc. 342, 249 (1994). A. Katz, A. J. Pearton, S. Nakahara, M. K. Chakrabarti, M. Geva and E. Lane, J. Appl. Phys. 70, 3666 (1991). O. D. Agnello, M. S. Kuan, J. Electrochem. Soc. 138, 3042 (1991). A. Katz, A. J. R Abernathy, M. S. Jones, J. Vac. Sci. Technol. 89,2466 (1991). E. Fair, Solid St. Technol. 35 (8), 47 (1992). R Pascual, M.
Inst. of Michigan, Ann Arbor, 1989, pp. 95. F. Y. -H. Ku, Mat. Res. Soc. Symp. Proc. 146,27 (1989). R. Wollmann, Electro-opt. Syst. Des. 11 (9),37 (1979). -L. Regolini, D. Dutartre, D. Bensahel and J. Penelon, Solid St. Techno/. 34 (2), 47 (1991). R. B. M. Paulson, Mat. Res. Soc. Symp. Proc. 52, 181 (1986). F. Roozeboom and N. Parekh, J. Vac. Sc. Techno/. 88, 1249 (1990). P. E. Rondeau, J. Thermophysics 3,153 (1989). C. Sturm and A. Reddy, Mat. Res. Soc. Symp. Proc. 387, 137 (1995). G. Bobel, H.